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0571-82835676
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Pioneeringhigh speed design capability
Perfect high-speed platformMore than 20 years of design experience
80+ engineers with solid theoretical knowledge
Rich system simulation design and engineering problem solving ability
System solutionFast: Simulation and design are completed simultaneously
Full: Simulation full traversal, hit the key point of the problem
Standard: 112G bandwidth simulation technology, test and simulation closed loop
Help all industriesHelp customers succeed in one edition
Low cost, high quality
Wide customer coverage
Internet, servers, switches, ICT..
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We can do so much moreIEEE:10G/25G/28G/56G/112G
5600M for DDR5 and 16G for GDDR6
PCIE5, USB3.0, SAS/SATA
IR·Drop, PDN impedance analysis
Electrothermal simulation, transient simulation
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Deeply accumulated
PCB platform capability
- 20+ years
PCB design and development experience accumulated
- Up to 34 floors
Maximum 92,000 pins
- 300+ articles
Design specifications, experience cases, operation guidance, and have a perfect training system and a strong communication atmosphere
- Many domestic head
Previous cooperation experience of chip companies, forward-looking technology accumulation
- 20+ years
Completeoverall structure design ability
Wide range of business support
Structural design, industrial design, packaging design
Cable design, label design
High performance design assurance
DFX, structural stiffness strength simulation
Mechanism dynamics simulation, ergonomic simulation
Thermal design green energy saving
Advanced thermal design platform, complete thermal testing
High efficiency and energy saving heat dissipation control,
New liquid cooling design research
Rich immersed design delivery
Advancedthermal design capability
- 01 Air cooling schemeAir cooled compatible cold plate solution
Single chip power consumption 800W+
23W 800G QSFP - 02 Cold plate liquid cooling solutionSingle phase cold plate liquid cooling scheme
Low flow resistance, low cost, high reliability
Flexible quick insert (manual insert, blind insert) - 03 Submerged liquid cooling solutionSingle-phase, two-phase submerged liquid cooling scheme
Horizontal TANK, vertical cabinet blind insertion
Intelligent alarm strategy
Material compatible and reliable - 04 Fanless cooling designShortest thermal conductivity path scheme
Wide temperature 70 degrees
SFP+ 80Km
Complexprocess design capability
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- High complexity veneer assembly technology
- With a wealth of highly complex veneer, large BGA chip and large size veneer process assembly technology and successful cases
92k pinHigh complexity veneer
1000mmOversized veneer
90*80mmVery large chip
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0.35mmClose-spaced device
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- Long-term reliability verification solution
- Stress simulation to stress testing, red ink and slice analysis to form a closed loop from process reliability simulation to validation
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Plate level stressSimulation analysis
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VeneerStress test
Red ink experiment
Slice experiment
Top ten professional laboratories
Build a product reliability center
For all the company's products from the device to the whole machine, on the signal quality testing, safety, electromagnetic compatibility, environmental adaptability and reliability of more than 100 items of rigorous testing and inspection
It is the high reliability guarantee of the company's products, the cornerstone of the company's products to obtain various certifications at home and abroad, and the source of confidence that customers trust.
HALT Lab
Climatic Environment Laboratory
Mechanical Environment Laboratory
Device Analysis Laboratory
Technology Laboratory
Anechoic Room
EMS Laboratory
Structural Laboratory
Safety Laboratory
Drop lab
- HALT Lab
- Climatic Environment Laboratory
- Mechanical Environment Laboratory
- Device Analysis Laboratory
- Technology Laboratory
- Anechoic Room
- EMS Laboratory
- Structural Laboratory
- Safety Laboratory
- Drop Lab
Centre